Reflow Soldering Process Considerations for Surface Mount Application

Practical Considerations For Attaching Surface-mount Components

What automated soldering methods can be considered for Mini-Circuits surface-mount components? There are two basic methods: reflow and wave soldering. Generally, reflow soldering can be done when (l) there are only surface mount components, or (2) these are present together with through-hole components and the latter will be soldered in a separate (wave soldering) step. The surface-mount compon...

Precision Application of No-Clean Fluxes

T he no-clean manufacturing process involves several interrelated process steps. These steps include receiving a clean PCB; surface-mount paste screening, placement and reflow; throughhole component placement; flux application; and wave soldering. This article will focus on the application of flux to effectively obtain soldered boards with low residual flux levels. Existing technologies for flu...

Reflow Soldering Guidelines for Surface - Mount Devices

Instrumentation for Studying Real-time Popcorn Effect in Surface Mount Packages during Solder Reflow

Occurrence of popcorn in IC packages while assembling them onto the PCB is a well known moisture sensitive reliability issues, especially for surface mount packages. Commonly reflow soldering simulation process is conducted to assess the impact of assembling IC package onto PCB. A strain gauge-based instrumentation is developed to investigate the popcorn effect in surface mount packages during ...

SMT Line Improvements for High Mix, Low Volume Electronics Manufacturing

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